On the possible current transport mechanisms, Energy-dependent distribution profile of interface states, and temperature sensitivity in Au/(PEG:Er–MnFe2O4)/n–Si structures


ÇETİNKAYA H. G., Badali Y., ALTINDAL Ş.

Journal of Materials Science: Materials in Electronics, cilt.36, sa.15, 2025 (SCI-Expanded, Scopus) identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 36 Sayı: 15
  • Basım Tarihi: 2025
  • Doi Numarası: 10.1007/s10854-025-14923-8
  • Dergi Adı: Journal of Materials Science: Materials in Electronics
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Aerospace Database, Applied Science & Technology Source, Chemical Abstracts Core, Communication Abstracts, Compendex, Computer & Applied Sciences, INSPEC, MEDLINE, Metadex, Civil Engineering Abstracts
  • İstanbul Ticaret Üniversitesi Adresli: Evet

Özet

The Au/(PEG:Er–MnFe2O4)/n–Si junctions have been constructed and their possible charge/current transport mechanisms (CTMs) investigated across temperatures ranging from 80 to 340 K and a ± 3 V bias range using the I–V measurements. The forward bias semi-logarithmic I–V curves exhibited two distinct linear regimes. The semilogarithmic I–V characteristics show that while ideality factor (n) declines with inclining temperature, barrier height (BH) inclines. The thermionic emission model with double Gaussian dispersion (DGD) of the BHs was able to successfully explain such temperature-dependent changes in the BH and n. Plots of ΦB0-q/2kT, ΦB0-n, and n−1-q/2kT curves showed two linear-portions, indicative of a DGD. These findings suggest that the fabricated Au/(PEG:Er–MnFe2O4)/n–Si diode could serve effectively as a temperature-sensor (TS) in whole temperature range. The distribution profile of the interface traps (Dit) in the forbidden energy band was obtained from the Card&Rhoderick model by utilizing I–V data, considering the voltage-dependent ΦB(V) and n(V) values for each temperature. The observed declines with inclining temperature and shifting positions of them was attributed to the restructure/reorder of Dit under the temperature effect. The obtained results suggest that the fabricated these structures are very sensitive to temperature and voltage and so can be used as a temperature application.